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The Boeing India Engineering and Technology Center (BIETC) is looking for an Associate Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit.
The position will be a hands-on technical role with responsibility ranging from Chassis, Thermal, Printed circuit board, structural, fatigue, System level EMI/EMC and materials for requirements development, detailed design, documentation, analysis and testing. The successful candidate should have a track record of proven successes from previous work assignments
Position Responsibilities:
Basic Qualifications (Required Skills/Experience):
Preferred Qualifications (Desired Skills/Experience):
Typical Education & Experience:
Education/experience typically acquired through advanced education (e.g. Mechanical Engineering) and typically 2 to 5 years' related work experience or an equivalent combination of education and experience (e.g. Master+1 year's related work experience etc.).
Vaccination Requirements:
Boeing is implementing new requirements for employees to be fully vaccinated from COVID-19 or have an approved reasonable accommodation based on local legislation in several countries. For current vaccination and/or reasonable accommodation requirements, and timelines based on location.
Equal Opportunity Employer:
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.