Job Detail

ELECTRO-MECHANICAL PACKAGING DESIGN ENGINEER - Boeing

Date Posted:Sep 08, 2022

Job Detail

  • Location:
    Bangalore, Karnataka, India
  • Company:
  • Type:
    Full Time
  • Career Level:
    Mid-Senior level
  • Experience:
    5 Year
  • Gender:
    No Preference
  • Degree:
    Graduate
  • Apply Before:
    Nov 08, 2022

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Overview

Boeing is the world’s largest (Per Boeing LinkedIn page) aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace.

In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 75 years. People at Boeing have been supporting mission readiness and modernization of India’s defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 3000+ diverse engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts – enabling every voice to be heard and every perspective to be respected.  No matter where or how our teammates work, we are committed to positively shaping people’s careers and being thoughtful about employee wellbeing.

At Boeing, we are inclusive, diverse, and transformative.  

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

At Boeing, we are all innovators on a mission to connect, protect, explore and inspire. From the seabed to outer space, you’ll learn and grow, contributing to work that shapes the world. Find your future with us.

At the highest level, diversity and inclusion are part of Boeing's values.  Having diverse employees, business partners and community relationships is vital to creating advanced aerospace and defense products and services for our diverse customers around the world. The company's commitment to diversity means providing a work environment for all employees that is welcoming, respectful and engaging, with opportunities for personal and professional development.

At Boeing, we are all innovators on a mission to connect, protect, explore and inspire. From the seabed to outer space, you’ll learn and grow, contributing to work that shapes the world. Find your future with us.

The Boeing India Engineering and Technology Center (BIETC) is looking for an Electro-Mechanical Packaging Design Engineer for a key role in development of a growing business unit.  The position will be a hands on technical role with responsibility ranging from Chassis, thermal, printed circuit board, structural, fatigue, System level EMI/EMC and materials for requirements development, detailed design, documentation, analysis and testing. The successful candidate should have a track record of demonstrated successes from previous work assignments.

Position Responsibilities:

  • Executing projects independently without supervision
  • Working on Electronic Line Replaceable Unit design & development
  • Analyzing Customer & System Requirements to develop basic mechanical packaging and printed circuit design approach for power supplies and control units
  • Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers, PCB/PWA, Thermal, EMI/EMC, Systems.
  • Identifying and tracking technical performance metrics to measure progress and ensure compliance with requirements
  • Providing technical guidance and mentoring team during project execution
  • Validating designs through thermal cycling, dynamic analyses and testing
  • Executing end-to-end project management, including some configuration management and change control

 Employer will not sponsor applicants for employment visa status.

Desired Skills:

  • Must understand the complete product development lifecycle, capture requirements, and provide technical guidance and decisions.
  • Hand on experience in Mechanical Chassis design (End-to-End) for Rugged/Sheet metal LRU and test equipment.
  • Experience in detailed development of modules, chassis, heat sinks, fans and mechanical fasteners and COTS selection for connectors etc.
  • Experience in requirements capture for printed circuit board (PCB) layout, electrical interconnect, route/Via/keep out, critical thermal component, mounting holes, heat sink placement design.
  • Hand on experience in mechanical tolerance and stack up analysis.
  • Hand on experience on DFM/DFA/DFX
  • Hand on experience on chassis level EMI/EMC calculation as an added advantage
  • Experience in Aerospace Material selection, Manufacturing processes and finish
  • Experience in Aerospace - DO-160 and MIL-STD-810 is required. 
  • Experience with static and dynamic structural analysis, solder joint / lead fatigue analysis, thermal analysis (Passive/Active cooling) as an added advantage.
  • Experience on reliability of electronic component selection and design for reliability is an added advantage.
  • Understanding of configuration management, requirements traceability (DOORS) and related processes is an added advantage
  • Technical team leadership and mentoring skills. Ability to coordinate multi-discipline team.
  • Experience in using Engineering design tools, Creo, Catia V5, NX.
  • Knowledge or hands on experience of Analysis tools, Nastran/Patran, Flotherm -12.1 is an added advantage
  • Experience in MBE and 3DX is an added advantage. 

Typical Education & Experience:

  • Mechanical Engineering degree with 5 to 9 years of related work experience or a Master's degree with 4 to 8 years related work experience or an equivalent combination of education and experience..

Relocation:

RELOCATION BENEFITS IF INDICATED ARE LIMITED TO IN-COUNTRY MOVES AND ARE NOT AVAILABLE FOR OVERSEAS RELOCATION. THERE IS NO EXPATRIATE PACKAGE ASSOCIATED WITH THIS POSITION.

Skills Required

Job is expired

Company Overview

New Delhi, Delhi, India

We are the world’s largest aerospace company and leading provider of commercial airplanes, defense, space and security systems, and global services. Building on a legacy of aerospace leadership, Boeing continues to lead in technology and innovation,... Read More

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