Job Detail

LEAD ELECTRONICS PACKAGING DESIGN & ANALYSIS ENGINEER - Boeing

Date Posted:Jun 22, 2022

Job Detail

  • Location:
    Bangalore, Karnataka, India
  • Company:
  • Type:
    Full Time
  • Career Level:
    Experienced Professional
  • Experience:
    Professional
  • Gender:
    No Preference
  • Degree:
    Graduate
  • Apply Before:
    Aug 22, 2022

Job Description

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Job Title:  Lead Electro Mechanical Packaging Design & Analysis Engineer

Overview

Boeing is the world’s largest (Per Boeing LinkedIn page) aerospace company and a leading provider of commercial airplanes, defense, space, and security systems, and global services. Building on a legacy of over a century of innovation and leadership, Boeing continues to lead the way in technology and innovation, customer delivery, and investment in its people and future growth of aerospace.

In India, Boeing has been a strong partner to the Indian aerospace and defense sectors for more than 75 years. People at Boeing have been supporting mission readiness and modernization of India’s defense forces, and enabling connected, safer, and smarter flying experiences, in the sky, in the seas, and in space.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 3000+ diverse engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global markets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring diverse perspectives and thoughts – enabling every voice to be heard and every perspective to be respected.  No matter where or how our teammates work, we are committed to positively shaping people’s careers and being thoughtful about employee wellbeing.

At Boeing, we are inclusive, diverse, and transformative.  

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

Position Overview

The Boeing India Engineering and Technology Center (BIETC) is looking for a Lead Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit.  The position will be a hands-on technical role with responsibility ranging from printed circuit board, chassis, thermal, structural, fatigue and materials to requirements development, detailed design, documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments.

Position Responsibilities:

The successful candidate will perform the following duties:

  • Working on Electronic Line Replaceable Unit design & development for complex electro-mechanical System and components
  • Analyzing Customer & System Requirements to develop multi mechanical design concepts and printed circuit design approach for power supplies and control units
  • Ability to perform design calculations to develop mechanical design concepts
  • Conduct thermal, stress and dynamic analysis to validate designs through testing.
  • Validating designs through thermal, dynamic, solder/joint lead fatigue analyses and testing
  • Identifying and tracking technical performance metrics to measure progress and ensure compliance with requirements
  • Collaborating & communicating with multi-functional teams and all collaborators, especially electronics circuit designers and manufacturing engineers to ensure that the hardware meets imposed customer and derived requirements
  • Providing technical guidance and mentoring team during project execution
  • Implementing end-to-end project management, including some configuration management and change control
  • Represent Mechanical Engineering in IPT meetings, design reviews, customer meetings, audits and other activities.
  • Must be able to work well in domestic and global teams from a modern innovative and collaborative environment.
  • Train and mentor other engineers, handle one or more projects.
  • Strong problem-solving skills and the ability to proactively think out of the box preferred.

Basic Qualifications (Required Skills/Experience)

  • Bachelor, Master or equivalent degree preferably in Engineering is required
  • Experienced in various technologies in product design, including but not limited to Machined part design, sheet metal parts, Plastic injection molding, die casting, rapid prototyping and material and finish selection.
  • Must understand the complete product development lifecycle, capture requirements and provide technical guidance and decisions.
  • Experience in detailed development and COTS selection of power and analog/control electronic printed circuit boards, connectors, modules, chassis, heat sink and mechanical fasteners.
  • Experience in requirements gather for printed circuit board (PCB) layout, and electrical interconnect design.
  • Experience in Mechanical Chassis design (End-to-End) for Rugged/Sheet metal LRU and test equipment.
  • Experience in Heat Sink Design, Fan Selection, Component and System level cooling.
  • Experience with static and dynamic structural analysis, solder joint / lead fatigue analysis, thermal analysis (passive and active cooling) and mechanical tolerance analysis.
  • Experience with high reliability of electronic component selection and design for reliability.
  • Understanding of configuration management, requirements traceability (DOORS) and related processes.
  • Experience in Aerospace Material Selection, Manufacturing processes and Finish.
  • Experience in Aerospace - DO-160 and MIL-STD-810 is required. 
  • Strong technical team leadership and mentoring skills. Ability to coordinate multi-discipline team.
  • Strong technical writing and verbal communication skills.
  • Experience in using Engineering design tools, specifically, 3D CAD tools such as Creo, NX, Catia/3DX and understanding of ASME Y14.5 Geometric Dimensioning and Tolerance Standards
  • Experience in using Engineering CFD design tool – FloTherm
  • Experience in using Engineering CAE/FEA analyses software- Nastran/Patran or Ansys Workbench
  • Experience supporting design fit checks during integration and test at the module, sub-system and system level.

Typical Education & Experience:

Typically, 13 to 16 years of related work experience. Advanced degree (e.g. Bachelor, Master, etc.) preferred.

Relocation:

This position offers relocation based on candidate eligibility.

Skills Required

Company Overview

New Delhi, Delhi, India

We are the world’s largest aerospace company and leading provider of commercial airplanes, defense, space and security systems, and global services. Building on a legacy of aerospace leadership, Boeing continues to lead in technology and innovation,... Read More

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